Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA60R230P6
MA001356090
PG-TO220-3-253
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
6.823
1.431
0.429
1428.770
2.992
3.339
130.217
534.224
21.731
1.786
0.349
0.872
2.268
Average
Mass
[%]
0.32
0.07
0.02
66.90
0.14
0.16
6.10
25.02
1.02
0.08
0.02
0.04
0.11
17. April 2015
2135.23 mg
Sum
[%]
0.32
Average
Mass
[ppm]
3196
670
201
66.99
0.14
669141
1401
1564
60985
31.28
1.02
0.08
250195
10177
836
163
409
0.17
1062
1634
1000000
312744
10177
836
670012
1401
Sum
[ppm]
3196
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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