Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE82453-3SA
MA001270292
PG-DSO-36-54
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
21.749
0.387
1.547
30.947
1256.594
2.672
1.521
69.947
688.822
15.232
0.683
0.158
0.105
10.281
Average
Mass
[%]
1.04
0.02
0.07
1.47
59.82
0.13
0.07
3.33
32.79
0.73
0.03
0.01
0.00
0.49
18. May 2015
2100.65 mg
Sum
[%]
1.04
Average
Mass
[ppm]
10354
184
737
14732
61.38
0.13
598194
1272
724
33298
36.19
0.73
0.03
327910
7251
325
75
50
0.50
4894
5019
1000000
361932
7251
325
613847
1272
Sum
[ppm]
10354
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
