Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD50R280CE
MA001456554
PG-TO252-3-341
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
4.825
0.248
0.075
248.124
16.046
0.340
10.300
102.552
3.787
0.515
0.097
0.078
3.701
Average
Mass
[%]
1.23
0.06
0.02
63.51
4.11
0.09
2.64
26.25
0.97
0.13
0.02
0.02
0.95
22. October 2015
390.69 mg
Sum
[%]
1.23
Average
Mass
[ppm]
12349
636
191
63.59
4.11
635096
41071
869
26365
28.98
0.97
0.13
262492
9693
1319
248
198
0.99
9473
9919
1000000
289726
9693
1319
635923
41071
Sum
[ppm]
12349
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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