Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BFP 760 H6327
MA001369468
PG-SOT343-4-2
Material Group
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
tin
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.003
0.001
0.020
0.001
0.003
0.010
3.433
0.010
0.030
0.652
2.349
0.202
0.216
Average
Mass
[%]
0.04
0.01
0.29
0.01
0.05
0.15
49.53
0.15
0.44
9.40
33.90
2.91
3.12
20. May 2015
6.93 mg
Sum
[%]
Average
Mass
[ppm]
388
100
0.34
2878
100
498
1492
49.74
0.15
495378
1466
4374
94038
43.74
2.91
3.12
338975
29107
31206
437387
29107
31206
1000000
497468
1466
3366
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
PCB设计
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