Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTM7740G
MA001363416
PG-DSO-28-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
5.615
0.072
0.288
5.754
233.637
1.602
1.109
79.289
474.072
4.975
0.678
0.353
1.663
Average
Mass
[%]
0.69
0.01
0.04
0.71
28.88
0.20
0.14
9.80
58.59
0.61
0.08
0.04
0.21
30. April 2015
809.11 mg
Sum
[%]
0.69
Average
Mass
[ppm]
6940
89
356
7112
29.64
0.20
288759
1980
1371
97996
68.53
0.61
0.08
585921
6148
837
436
0.25
2055
2491
1000000
685288
6148
837
296316
1980
Sum
[ppm]
6940
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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