WF5028 series
0.8V operation Crystal Oscillator Module ICs
OVERVIEW
The WF5028 series are miniature crystal oscillator module ICs. The devices are fabricated using a proprietary
low voltage process, enabling 0.8V operation. The pad layouts are selective from 3 types depending on pack-
age structures, mounting methods, which are suitable for miniature crystal oscillators. The WF5028 series can
be used to realize ultra miniature, ultra low voltage crystal oscillators.
FEATURES
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Wide range of operating supply voltage: 0.8 to 2.0V
Optimized low crystal drive current oscillation for
miniature crystal units
3 pad layout options for mounting
• WF5028A× series: for Flip Chip Bonding
• CF5028B× series: for Wire Bonding (type I)
• CF5028C× series: for Wire Bonding (type II)
Recommended oscillation frequency range:
20MHz to 50MHz
Multi-stage frequency divider for low-frequency
output support: 0.75MHz (min)
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Frequency divider built-in
• Selectable by version: f
O
, f
O
/2, f
O
/4, f
O
/8, f
O
/16,
f
O
/32, f
O
/64
−40
to 85°C operating temperature range
Standby function
• High impedance in standby mode, oscillator
stops
CMOS output duty level (1/2VDD)
50 ± 5% output duty
15pF output drive capability
Wafer form (WF5028××)
Chip form (CF5028××)
APPLICATIONS
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3.2
×
2.5, 2.5
×
2.0, 2.0
×
1.6 size miniature crystal oscillator modules
ORDERING INFORMATION
Device
WF5028××–4
CF5028××–4
Package
Wafer form
Chip form
SEIKO NPC CORPORATION —1
WF5028 series
SERIES CONFIGURATION
Version
*1
Operating
supply voltage
range [V]
Oscillation
mode
Recommended
oscillation frequency
range
*2
[MHz]
Output
frequency
f
O
(oscillation
frequency)
f
O
/2
f
O
/4
0.8 to 2.0
Fundamental
20 to 50
f
O
/8
f
O
/16
f
O
/32
f
O
/64
±3
Yes
Hi-Z
Standby mode
Output drive
capability [mA] Oscillator stop
Output state
(V
DD
= 1.2V)
function
WF5028×1
WF5028×2
WF5028×3
WF5028×4
WF5028×5
WF5028×6
WF5028×7
*1. Chip form devices have designation CF5028××.
*2. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the
oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting condi-
tions, so the oscillation characteristics of components must be carefully evaluated.
VERSION NAME
Device
WF5028××–4
Package
Wafer form
Version name
WF5028
Form WF: Wafer form
CF: Chip (Die) form
−4
Frequency divider function
Pad layout type A: for Flip Chip Bonding
B: for Wire Bonding (type I)
C: for Wire Bonding (type II)
CF5028××–4
Chip form
SEIKO NPC CORPORATION —2
WF5028 series
PAD LAYOUT
(Unit:
µm)
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WF5028A×
(for Flip Chip Bonding)
(750,690)
VSS
5
6
1
(0,0)
XT
X
2
XTN
4
3
Q
VDD
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CF5028B×
(for Wire Bonding (type I))
(750,690)
Q
5
6
1
(0,0)
XTN
X
2
XT
4
3
VSS
INHN
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CF5028C×
(for Wire Bonding (type II))
(750,690)
VDD
5
6
1
(0,0)
XT
X
2
XTN
4
3
Q
VSS
Y INHN
Y
VDD
Y INHN
Chip size: 0.75
×
0.69mm
Chip thickness: 130 ± 15µm
PAD size: 90µm
Chip base: V
SS
level
Chip size: 0.75
×
0.69mm
Chip thickness: 130 ± 15µm
PAD size: 90µm
Chip base: V
SS
level
Chip size: 0.75
×
0.69mm
Chip thickness: 130 ± 15µm
PAD size: 90µm
Chip base: V
SS
level
PAD DIMENSIONS
Pad dimensions [µm]
Pad No.
X
1
2
3
4
5
6
229
520
636
636
114
114
Y
114
114
304
531
531
304
PIN DESCRIPTION
Pad No.
Pin
5028A× 5028B× 5028C×
1
2
3
4
5
6
2
1
6
5
4
3
1
2
5
4
3
6
XT
XTN
VDD
Q
VSS
INHN
Amplifier input
Amplifier output
(+) supply voltage
Output
(–) ground
Output state
control input
Crystal connection pins. Crystal is connected
between XT and XTN.
–
Output frequency determined by internal circuit
to one of f
O
, f
O
/2, f
O
/4, f
O
/8, f
O
/16, f
O
/32, f
O
/64
–
High impedance when LOW (oscillator stops).
Power-saving pull-up resistor built-in.
Name
Description
BLOCK DIAGRAM
VDD VSS
INHN
R
F
DIVIDER
CMOS
Q
XT
R
D
C
G
C
D
XTN
SEIKO NPC CORPORATION —3
WF5028 series
VERSION DISCRIMINATION INTERNAL COMPONENTS
The WF5028 series device version is not determined solely by the mask pattern, but can also be determined by
the trimming of internal trimming fuses.
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Version determined by laser trimming:
These chips are produced from a common device by the laser trimming of fuses corresponding to the ordered
version, shown in table 1. These devices are shipped for electrical characteristics testing. Laser-trimmed ver-
sions are identified externally by the combination of the version name marking (1) and the locations of
trimmed fuses (2).
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Version determined by mask pattern:
These chips are fabricated using the mask corresponding to the ordered version, and do not require trimming.
Mask-fabricated versions are identified externally by the version name marking (1) only.
Since the WF5028 series devices are manufactured using 2 methods, there are 2 types of IC chip available
(identified externally) for the same version name. The identification markings for all WF5028 series device
versions is shown in table 2.
(750,690)
(1) Version code on die
Table 1. Version and trimming fuses
Trimming fuse number
*1
Version
F1
WF5028×1
WF5028×2
WF5028×3
WF5028×4
WF5028×5
WF5028×6
WF5028×7
–
×
–
×
–
×
–
F2
–
–
×
×
–
–
×
F3
–
–
–
–
×
×
×
5028
NPC
(2) Trimming fuses
F1
F2
F3
F4
F5
F6
F7
F8
F9
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5028×1 trimming fuses (untrimmed)
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5028×2 trimming fuses (F1 link trimmed)
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5028×3 trimming fuses (F2 link trimmed)
*1. –: untrimmed,
×:
trimmed, F4 to F9 not used
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5028×4 trimming fuses (F1 and F2 links trimmed)
: trimmed device
SEIKO NPC CORPORATION —4
WF5028 series
Table 2. Version identification by version name and chip markings
Version set by trimming fuses
Version
name
Version
name chip
marking
AX
AX
AX
AX
AX
AX
AX
BX
BX
BX
BX
BX
BX
BX
CX
CX
CX
CX
CX
CX
CX
Trimming fuses
*1
F1
−
×
−
×
−
×
−
−
×
−
×
−
×
−
−
×
−
×
−
×
−
F2
−
−
×
×
−
−
×
−
−
×
×
−
−
×
−
−
×
×
−
−
×
F3
−
−
−
−
×
×
×
−
−
−
−
×
×
×
−
−
−
−
×
×
×
Untrimmed
F4
F5
F6
F7
F8
F9
Version set by mask pattern
Version
name chip
marking
AX
A2
A3
A4
A5
A6
A7
BX
B2
B3
B4
B5
B6
B7
CX
C2
C3
C4
C5
C6
C7
Untrimmed
Trimming
fuses
F1 to F9
5028A1
5028A2
5028A3
5028A4
5028A5
5028A6
5028A7
5028B1
5028B2
5028B3
5028B4
5028B5
5028B6
5028B7
5028C1
5028C2
5028C3
5028C4
5028C5
5028C6
5028C7
*1.
−:
untrimmed,
×:
trimmed
SEIKO NPC CORPORATION —5
微控制器 MCU
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