Power Ring Film Capacitors
SBE Part 700D10896-348
TM
Power Ring Film Capacitor™
1000 µF, 600 Vdc
The 700D10896-348 Power Ring is a
600Vdc, 1000 µF DC Link Capacitor with
Power
and
Film Capacitors
™
an ESR of 125 micro-Ohms at 20kHz
Ring
an ESL of less than 5nH.
SBE Part #: 700D10896-348
Electrical Specifications
Power Ring Film Capacitor™
SBE Part #:
700D10896-348
1000 µF, 600 VDC
Capacitance/Tolerance:
1000 µF ±10%
DC Voltage Rating:
Electrical Specifications
ESL:
Less than 5 nH in a suitable
laminar bus structure
600 Vdc
Operating Temperature:
-40°C to +85°C at full
DC voltage rating
Voltage, Temperature
De-rate voltage linearly to
De-rating:
400 Vdc from +85°C to +105°C
Dielectric/Construction:
Metallized polypropylene.
SBE Part #:
700D10896-348
Single section design
Capacitance/Tolerance:
Dielectric Withstand:
1000 µF
±10%
tested at DC
Units 100%
DC Voltage
Rating:
600
potential of 750 Volts for two
VDC
System Fault Current
10,000 Amps maximum
minutes at 25°C
Single section design, non-inductively wound
the
Rating (external to
Dielectric/Construction:
Metallized Polypropylene.
capacitor):
Dielectric Withstand:
Unit shall withstand a DC potential of 750 Volts for two minutes
100 MΩ Min at +25°C
Insulation Resistance:
Typical ESR vs.
ESR vs. Frequency:
Frequency:
2
RMS Current Rating:
600
500
1.5
Maximum Ripple Current (A rms)
ESR, milliohms
400
Case Side Cooling Only
Case and Bus Side Cooling
1
300
200
700D348 with 20 kHz ripple current
100
Temperature rise due to capacitor losses only
Bus heat load NOT included
0.5
0
0.01
0.1
Frequency, KHz
1
10
100
1000
0
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
Case Temperature (
o
C)
SBE reserves the right to amend design data
At the Leading Edge of Film Capacitor Technology®
1.
2.
3.
4.
5.
The thermal resistance is that from capacitor to application. This is a function of the application
environment, not the capacitor itself.
The capacitor can handle extreme current for small duty ratios. Trise occurs very slowly. This is
because the capacitor has a high specific heat.
TM
These charts can be adapted for other currents by multiplying y axis values for any time by
(Iapp/200)²
Internal capacitor Trise is added to the capacitor surface/terminal temperature.
For 200 A
RMS
the assumed 10°C internal Trise is very conservative based on simulation results
and verification measurements.
Terminals are assumed to be at case temperature.
Power Ring Film Capacitors
SBE Part 700D10896-348
Thermal Specifications
Here are two representations of “Capacitor Surface
Temperature over Time” for two specific Thermal
Resistances of 1°C/W and 0.5°C/W.
Notes regarding these graphs:
• The thermal resistance is that from capacitor to
application. This is a function of the application
environment, not the capacitor itself.
• The capacitor can handle extreme current for small
duty ratios. Trise occurs very slowly. This is because
the capacitor has a high specific heat.
• These charts can be adapted for other currents by
multiplying y axis values for any time by (Iapp/200)²
• Internal capacitor Trise is added to the capacitor
surface/terminal temperature.
• Terminals are assumed to be at case temperature.
6.
Sample 1.
Capacitor surface temperature rise above application
environment @ 200 Amps RMS current load, 10 KHz.
Sample 1.
Capacitor surface temperature rise above application environment @ 200 Amps
RMS current load, 10 KHz. Thermal resistance = 0.5°C/W:
Thermal resistance = 0.5°C/W:
28
Capacitor Surface Temp. deg C
27.5
27
26.5
26
25.5
25
0
1000
Time in seconds
2000
3000
4000
Sample 2.
Capacitor surface temperature rise above application
Sample 2.
Capacitor surface temperature rise above application
environment @ 200 Amps RMS current load, 10 KHz.
environment @ 200 Amp
RMS current load, 10 KHz.
Thermal resistance = 1°C/W:
Thermal resistance = 1°C/W:
31
Capacitor SurfaceTemp. deg C
30
29
28
27
26
25
0
2000
Mechanical Specifications
Dimensions:
Terminals:
Refer to layout details
Tin plated copper,
0.032” thick
Molded polymer case,
potted with RTV
Encapsulation:
Marking:
Mechanical Specifications
SBE
SBE company identification
700D348
SBE “short form” part number
Dimensions:
Refer to layout details
1000 µF ±10% Capacitance value and
Terminals:
Nickel plated copper, 0.032” thick
Encapsulation:
Polycarbonate outer housing, potted with RTV silicone
tolerance
600 Vdc
DC voltage rating
SBE
SBE Company Identification
Marking:
yyww-lot#-unit 12-digit serial number (date
700D348
SBE Part Number
1000
μ
F ±10% Capacitance value and tolerance
code, lot number, unit number)
600 VDC
yyww
Mechanical Mounting and additional thermal notes:
Time in seconds
4000
6000
8000
DC Voltage Rating
Weekly date code
(i.e. 0915 = 15
th
week of 2009)
SBE Inc. 81 Parker Road
Barre, Vermont 05641 USA
This capacitor is optimized for extremely low self inductance when connected to a suitable coplana
structure. When so connected, the capacitor is very rigidly attached to such a structure and thus d
SBE reserves the right
not
amend design data
be mounted to a chassis. However, the capacitor case can be attached to
to
necessarily need to
application surface/heat sink, etc. if desired.
www.SBElectronics.com
can be part of the bu
telephone:
802.476.4146
web site:
When so mounted, the capacitor
structure support. Use of thermal interface compound between the capacitor case and application
fax:
802.661.3950
sink will assist with removal of capacitor and bus heat. Note that the capacitor interna
e-mail:
PowerRing@SBElectronics.com
surface/heat
is VERY small, and other bus structure heat sources are very likely significantly higher than the hea
added to the bus by the capacitor. Capacitor dissipation is approximately 5W at 200ARMS, from 1
Power Ring Film Capacitors
SBE Part 700D10896-348
TM
Mechanical Mounting and Additional Thermal Notes:
that the capacitor internal heating is VERY small, and
other bus structure heat sources are very likely signifi-
This capacitor is optimized for extremely low self
cantly higher than the heat added to the bus by the
inductance when connected to a suitable laminar bus
capacitor. Capacitor dissipation is approximately 5W at
structure. When so connected, the capacitor is very
200Arms, from 1-100KHz. It is highly recommended to
rigidly attached to such a structure and thus does not
use infrared thermal imaging from a system cold start
necessarily need to be mounted to a chassis. However, to determine the location and relative magnitude of
the capacitor case can be attached to an application
thermal input to the bus. The capacitor may well func-
surface/heat sink, etc. if desired. When so mounted,
tion as a thermal conduit for bus structure heat, and
the capacitor can be part of the bus structure sup-
it will be very possible that the capacitor internal hot
port. Use of thermal interface compound between the
spot is less than the terminal temperature.
capacitor case and application surface/heat sink will
Thermal contour maps are available for some repre-
assist with removal of capacitor and bus heat. Note
sentative conditions.
Layout Details:
NOTES:
1.
2.
All Hole Positions Inspected
All Dimensions Inspected Unless
Marked As Reference
7X 45.0°
22.5°
6.868
Bolt Circle
C
A
16X M5X0.8 - 6H THRU
28 in-lbs MAX Torque
.020 A B C
Revisions
REV.
01
02
DESCRIPTION
Initial Release
Standardized Layout View
CHG
BY
-
AGH
CHK
BY
-
MGS
APR
BY
-
MSB
DATE
-
12/14/2010
B
8.746
Bolt Circle
8.465
9.252
Bolt Circle
4X .197±.005 THRU
Accepts 1/4" Plastite Screw
40 in-lbs MAX Torque
.020
M
A B C
.040
16 Surfaces
.260
A
2.154
1.000
.663
.500
.280
NON-TOLERANCED DIMENSIONS ARE BASIC
.010 A B C
UNLESS OTHERWISE SPECIFIED:
ALL DIMENSIONS ARE IN INCHES
SBE, INC.
81 PARKER ROAD
BARRE, VT 05641 USA
802.476.4146 FAX: 802.661.3950
TITLE
GEOMETRIC TOLERANCING PER: Y14.5-2009
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF SBE. ANY
REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF SBE IS PROHIBITED.
DETAIL A
SCALE 1 : 1
MATERIAL
DRAWN
CHECKED
ENG APPR.
FINISH
MGS
DMB
MSB
11/12/2010
11/12/2010
Power Ring Capacitor,
1000uF, 600VDC
DWG. NO.
700D348LV
DO NOT SCALE DRAWING
SIZE
A
REV
02
SHEET 1 OF 1
Contact SBE Inc. to discuss your specific requirements.
SBE reserves the right to amend design data
At the Leading Edge of Film Capacitor Technology®
Power Ring Film Capacitors
SBE Part 700D10896-348
TM
Advantages of Power Ring DC Link Capacitors
• Ability to handle higher ripple currents with less
capacitance, weight, and volume
• Use of 105°C ICE coolant for power
electronics cooling
• Demonstrated MTTF >> 20,000 hours for realistic
operating conditions, due to lower losses and
better thermal performance
• Minimization of IGBT overshoot and elimination of the
need for additional snubber capacitors
• Most effective isolation of DC storage or supply
from AC switching artifacts
• Lowest industry ESL at <5nH typical with a
properly integrated bus structure
•
Smaller inverter packaging
•
Overall system cost savings
• Capacitance from 400 µF to 2500 µF and voltages
from 250 Vdc to 1200 Vdc
Integrating the Power Ring in an Existing Design
The “stacked” inverter design evolves from modifying
a typical automotive inverter by utilizing the excess
space left above the IGBT module (figure 1). By bend-
ing the end of the laminar bus plate, the IBGT, die,
cooling plate, and the ring capacitor are “stacked” on
top of each other in a symmetrical fashion. The ring
capacitor is placed underneath the cooling plate.
The cooling plate is shared with the IGBT module
which is mounted on the top.
Figure 1
The SBE Power Ring Film Capacitors™ utilize tradition-
ally available and economical polypropylene and poly-
ester capacitor dielectric films. However, the power
of the shape™ allows for both thermal and electrical
performance which has been unachievable in the film
capacitor industry to date.
Power Ring System Performance
The combination of lowest available Trise, ESR and ESL
coupled with highest ripple current handling capability
enable the development of industry leading inverter
designs with unbeatable performance and reliability.
Lowest available Trise for a given ripple current
Lowest available ESL, less than 5nH demonstrated with
optimal integrated bus
Lowest available ESR, less than 150 micro-Ohms typical
Crown terminal architecture provides for a multitude
of current paths which allows the monolithic capacitor
to function as a distributed element with a much lower
ESR than an equivalent array of smaller parts. SBE has
developed a next generation capacitor simulation tool
that allows accurate calculation of hotspot tempera-
ture to allow optimal rating with excellent reliability.
Figure 2
Figure 2 shows the “stacked” inverter design after the
integration of the ring capacitor and the laminar bus
plate. By now combining both aspects of vertical inte-
gration and the low temperature rise characteristics
of the capacitors, an increase to 50% or more volume
reduction is realistically possible. These improvements
clearly translate into weight and cost reductions.
#SBE-PR-348-01/11
SBE reserves the right to amend design data
SBE Inc. 81 Parker Road
Barre, Vermont 05641 USA
telephone:
802.476.4146
fax:
802.661.3950
web site:
www.SBElectronics.com
e-mail:
PowerRing@SBElectronics.com
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