Si2304DDS-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
Limit
30
± 20
3.6
a
3.3
3.3
2.7
15
1.4
0.9
b, c
1.7
1.1
1.1
b, c
0.7
b, c
- 55 to 150
260
Unit
V
A
P
D
T
J
, T
stg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum
Maximum Junction-to-Foot (Drain)
Notes:
a. Package limited
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 130 °C/W.
Junction-to-Ambient
b, d
t
≤
5s
Steady State
Symbol
R
thJA
R
thJF
Typical
90
60
Maximum
115
75
Unit
°C/W
Document Number: 65175
S09-1496-Rev. A, 10-Aug-09
www.vishay.com
1
New Product
Si2304DDS
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 2.7 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 2.7 A, V
GS
=
0 V
0.8
10
5
6
4
T
C
= 25 °C
1.4
15
1.2
20
10
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 5.6
Ω
I
D
≅
2.7 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 5.6
Ω
I
D
≅
2.7 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.8
V
DS
= 15 V, V
GS
= 10 V, I
D
= 3.4 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 3.4 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
235
45
17
4.5
2.1
0.85
0.65
4.4
12
50
12
22
5
12
10
5
8.8
20
75
20
35
10
20
15
10
ns
Ω
6.7
3.2
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 3.2 A
V
GS
=
4.5 V, I
D
= 2.8 A
V
DS
= 15 V, I
D
= 4.8 A
10
0.049
0.061
11
0.060
0.075
1.2
30
31
-5
2.2
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 65175
S09-1496-Rev. A, 10-Aug-09
New Product
Si2304DDS
Vishay Siliconix
TYPICAL CHARACTERISTICS
15
V
GS
= 10
V
thru 4
V
12
I
D
- Drain Current (A)
I
D
- Drain Current (A)
4
25 °C, unless otherwise noted
5
9
3
T
C
= - 55 °C
2
T
C
= 25 °C
1
T
C
= 125 °C
6
V
GS
= 3
V
3
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.10
300
Transfer Characteristics
R
DS(on)
- On-Resistance (Ω)
0.08
V
GS
= 4.5
V
0.06
V
GS
= 10
V
C - Capacitance (pF)
250
C
iss
200
150
0.04
100
C
oss
0.02
50
C
rss
0
5
10
15
20
25
30
0.00
0
3
6
9
12
15
0
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 3.4 A
V
GS
- Gate-to-Source
Voltage
(V)
8
V
DS
= 7.5
V
6
V
DS
= 24
V
4
V
DS
= 15
V
R
DS(on)
- On-Resistance
1.6
1.5
1.4
1.3
(Normalized)
1.2
1.1
1.0
0.9
0.8
0
0
1
2
3
4
5
0.7
- 50
I
D
= 3.2 A
Capacitance
V
GS
= 10
V
2
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 65175
S09-1496-Rev. A, 10-Aug-09
www.vishay.com
3
New Product
Si2304DDS
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.14
I
D
= 3.2 A
R
DS(on)
- On-Resistance (Ω)
0.12
I
S
- Source Current (A)
10
T
J
= 150 °C
0.10
T
J
= 25 °C
0.08
T
J
= 125 °C
1
0.06
T
J
= 25 °C
0.1
0.0
0.04
0.3
0.6
0.9
1.2
1.5
0
2
4
6
8
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
2.4
25
On-Resistance vs. Gate-to-Source Voltage
2.2
20
2.0
V
GS(th)
(V)
Power (W)
15
I
D
= 250
µA
1.8
10
1.6
5
1.4
1.2
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
I
D
- Drain Current (A)
10
100
µs
Single Pulse Power
1
1 ms
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.1
1
1 s, 10 s
DC
BVDSS Limited
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 65175
S09-1496-Rev. A, 10-Aug-09
New Product
Si2304DDS
Vishay Siliconix
TYPICAL CHARACTERISTICS
5
25 °C, unless otherwise noted
2.0
4
I
D
- Drain Current (A)
1.5
Package Limited
3
Power (W)
1.0
2
0.5
1
0
0
25
50
75
100
125
150
0.0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
当今的计算机外部设备，都在追求高速度和高通用性。为了满足用户的需求，以Intel为首的七家公司于1994年推出了USB（Universal Serial Bus，通用串行总线）总线协议，专用于低、中速的计算机外设。目前，USB端口已成为微机主板的标准端口；而在不久的将来，所有的微机外设，包括键盘、鼠标、显示器、打印机、数字相机、扫描仪和游戏柄等等，都将通过USB与主机相连。
...[详细]
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