Bond-Ply
®
LMS-HD
October 2014
PRODUCT DESCRIPTION
Laminate Material - Silicone, High Durability,
Optional Lamination Methods
FEATURES AND BENEFITS
• TO-220 Thermal performance: 2.3°C/W,
initial pressure only lamination
• Exceptional dielectric strength
• Very low interfacial resistance
• 200 psi adhesion strength
• Continuous use of -60 to 180°C
• Eliminates mechanical fasteners
PROPERTY
Color
TYPICAL PROPERTIES OF BOND-PLY LMS-HD
IMPERIAL VALUE
Yellow
Fiberglass
0.010, 0.012
-76 to 356
200
METRIC VALUE
Yellow
Fiberglass
0.254, 0.305
-60 to 180
1.4
VALUE
5000
4000
5.0
10
11
TEST METHOD
Visual
—
ASTM D374
—
ASTM D1002
Reinforcement Carrier
Thickness (inch) / (mm)
Continuous Use Temp (°F) / (°C)
ADHESION
Lap Shear @ RT (psi) / (MPa)
ELECTRICAL
Breakdown Voltage, Sheet (Vac) (1)
Breakdown Voltage, Laminated (Vac) (2)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
TEST METHOD
ASTM D149
ASTM D149
ASTM D150
ASTM D257
U.L. 94
ASTM D5470
IPO
2.3
30
6
V-O
1.4
Constant
2.1
30
6
THERMAL
Post-Cured Thermal Conductivity (W/m-K) (3)
THERMAL IMPEDANCE vs LAMINATION METHOD
Lamination Pressure (75 psi) (4)
TO-220 Thermal Performance (°C/W)
CURE SCHEDULE
Cure @ 125°C (minutes) (5)
Cure @ 160°C (minutes) (5)
Bond-Ply LMS-HD is a thermally
conductive heat curable laminate material.
The product consists of a high
performance thermally conductive low
modulus silicone compound coated on a
cured core, and double lined with
protective films. The low modulus silicone
design effectively absorbs mechanical
stresses induced by assembly-level CTE
mismatch, shock and vibration while
providing exceptional thermal performance
(vs PSA technologies) and long-term
integrity. Bond-Ply
®
LMS-HD will typically
be used for structurally adhering power
components and PCBs to a heat sink.
®
1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle.
2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure
at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination
application.
3). The ASTM D5470 (Bergquist Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes
interfacial thermal resistance. These values are given for customer reference only.
4). TO-220 Thermal Performance testing, per The Bergquist RD2010 specification for Laminates, was completed on laminated
TO-220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during
the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing.
5). Cure Schedule – time after cure temperature is achieved at the interface. Ramp time is application dependent.
TYPICAL APPLICATIONS INCLUDE
• Discrete semi-conductor packages bonded to heat spreader or heat sink
CONFIGURATIONS AVAILABLE
• Roll form
• Sheet form
• Die-cut parts
Liner
Overall
Thickness
10 or 12 mil
Shelf Life:
Bond-Ply
®
LMS-HD is a
heat-cured material and should be stored
in temperature controlled conditions. The
recommended storage temperature range
of 5-25°C should be used to maintain
optimum characteristics for a 5-month
shelf life.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
Uncured
Silicone
Dispersion
Cured Core
Fiberglass
Liner
Note: Not to scale
PDS_BP_LMS HD_October 2014
TDS Bond-Ply
®
LMS-HD, October 2014
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In
case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user’s responsibility to
determine suitability for the user’s purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing,
Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits.
The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark
registered in the U.S. Patent and Trademark Office
Reference 0.1
Americas
+1.800.347.4572
Europe
+31.35.5380684
For the most direct access to local sales and technical support visit: www.bergquistcompany.com
Asia
+852.2690.9296
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
