Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD70N03S4L-04
MA000471394
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.552
0.234
0.070
234.187
2.487
1.259
22.032
102.605
3.740
0.091
0.000
0.041
0.033
1.576
Average
Mass
[%]
0.42
0.06
0.02
63.31
0.67
0.34
5.96
27.74
1.01
0.02
0.00
0.01
0.01
0.43
29. August 2013
369.91 mg
Sum
[%]
0.42
Average
Mass
[ppm]
4196
634
190
63.39
0.67
633096
6724
3403
59560
34.04
1.01
277379
10111
245
0.02
1
112
89
0.45
4260
4461
1000000
246
340342
10111
633920
6724
Sum
[ppm]
4196
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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