Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP90N06S4-04
MA000467716
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
5.184
0.816
0.245
815.335
6.411
8.888
97.767
485.875
21.462
0.244
0.001
0.099
0.079
3.796
0.590
0.177
589.466
Average
Mass
[%]
0.25
0.04
0.01
40.05
0.31
0.44
4.80
23.86
1.05
0.01
0.00
0.00
0.00
0.19
0.03
0.01
28.95
29. August 2013
2036.44 mg
Sum
[%]
0.25
Average
Mass
[ppm]
2546
401
120
40.10
0.31
400372
3148
4364
48009
29.10
1.05
238591
10539
120
0.01
1
49
39
0.19
1864
290
87
28.99
289460
289837
1000000
1952
120
290964
10539
400894
3148
Sum
[ppm]
2546
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com