Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSP603S2L
MA000467348
PG-SOT223-4-21
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.544
0.010
0.051
0.152
50.489
0.320
0.451
0.564
1.129
10.271
44.019
1.464
0.513
0.105
0.493
Average
Mass
[%]
2.26
0.01
0.04
0.14
44.86
0.28
0.40
0.50
1.00
9.12
39.10
1.30
0.46
0.09
0.44
29. August 2013
112.58 mg
Sum
[%]
2.26
Average
Mass
[ppm]
22601
90
450
1351
45.05
0.28
448490
2845
4010
5013
10026
91238
50.12
1.30
0.46
391018
13005
4557
929
0.53
4377
5306
1000000
501305
13005
4557
450381
2845
Sum
[ppm]
22601
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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