Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI80N03S4L-03
MA000427164
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
4.029
0.851
0.255
849.682
5.581
8.813
96.947
481.797
15.198
0.228
0.001
0.080
0.064
3.055
0.032
0.106
106.210
Average
Mass
[%]
0.26
0.05
0.02
54.03
0.35
0.56
6.16
30.63
0.97
0.01
0.00
0.01
0.00
0.19
0.00
0.01
6.75
29. August 2013
1572.93 mg
Sum
[%]
0.26
Average
Mass
[ppm]
2561
541
162
54.10
0.35
540190
3548
5603
61635
37.35
0.97
306306
9662
145
0.01
1
51
41
0.20
1942
20
68
6.76
67524
67612
1000000
2034
145
373544
9662
540894
3548
Sum
[ppm]
2561
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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