Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD30N10S3L-34
MA000391968
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
2.295
0.234
0.070
234.187
1.879
1.258
22.008
102.494
3.740
0.091
0.000
0.041
0.051
1.938
Average
Mass
[%]
0.62
0.06
0.02
63.26
0.51
0.34
5.94
27.68
1.01
0.02
0.00
0.01
0.01
0.52
29. August 2013
370.29 mg
Sum
[%]
0.62
Average
Mass
[ppm]
6199
633
190
63.34
0.51
632447
5076
3396
59435
33.96
1.01
276797
10100
245
0.02
1
110
137
0.54
5234
5481
1000000
246
339629
10100
633270
5076
Sum
[ppm]
6199
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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