Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP80N04S3-03
MA000366317
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
6.365
0.816
0.245
815.335
6.952
8.864
97.509
484.589
21.462
0.244
0.001
0.115
0.092
4.389
0.177
0.590
589.466
Average
Mass
[%]
0.31
0.04
0.01
40.01
0.34
0.44
4.79
23.79
1.05
0.01
0.00
0.01
0.00
0.22
0.01
0.03
28.94
29. August 2013
2037.21 mg
Sum
[%]
0.31
Average
Mass
[ppm]
3124
401
120
40.06
0.34
400220
3412
4351
47864
29.02
1.05
237870
10535
120
0.01
1
56
45
0.23
2154
87
290
28.98
289350
289727
1000000
2255
120
290085
10535
400742
3412
Sum
[ppm]
3124
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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