Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI80N04S3-06
MA000363513
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
3.047
0.851
0.255
849.682
5.808
8.824
97.061
482.365
15.198
0.228
0.001
0.068
0.055
2.612
0.032
0.106
106.210
Average
Mass
[%]
0.19
0.05
0.02
54.05
0.37
0.56
6.17
30.68
0.97
0.01
0.00
0.00
0.00
0.17
0.00
0.01
6.75
29. August 2013
1572.40 mg
Sum
[%]
0.19
Average
Mass
[ppm]
1938
541
162
54.12
0.37
540371
3694
5612
61728
37.41
0.97
306770
9665
145
0.01
1
43
35
0.17
1661
20
68
6.76
67546
67634
1000000
1739
145
374110
9665
541075
3694
Sum
[ppm]
1938
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com