Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI100N08S2-07
MA000275853
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
12.294
0.851
0.255
849.682
7.583
8.672
95.394
474.080
15.198
0.228
0.001
0.192
0.154
7.350
0.106
0.032
106.210
Average
Mass
[%]
0.78
0.05
0.02
53.84
0.48
0.55
6.04
30.04
0.96
0.01
0.00
0.01
0.01
0.47
0.01
0.00
6.73
19. February 2015
1578.28 mg
Sum
[%]
0.78
Average
Mass
[ppm]
7789
539
162
53.91
0.48
538358
4805
5495
60442
36.63
0.96
300377
9629
145
0.01
538357
122
98
0.49
4657
67
20
6.74
67295
67382
1000000
4877
145
366314
9629
539059
4805
Sum
[ppm]
7789
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com