Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB80N04S2-H4
MA000275590
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
10.198
0.853
0.256
851.691
6.975
8.709
95.801
476.103
9.657
0.228
0.001
0.165
0.132
6.310
Average
Mass
[%]
0.70
0.06
0.02
58.04
0.48
0.59
6.53
32.45
0.66
0.02
0.00
0.01
0.01
0.43
29. August 2013
1467.08 mg
Sum
[%]
0.70
Average
Mass
[ppm]
6951
581
174
58.12
0.48
580536
4754
5936
65301
39.57
0.66
324525
6582
156
0.02
0
113
90
0.45
4301
4504
1000000
156
395762
6582
581291
4754
Sum
[ppm]
6951
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
stm32/stm8
京公网安备 11010802033920号
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