CM1771
Advance Information
1-Channel ESD Protector
Product Description
The CM1771 provides robust ESD protection for sensitive parts that
may be subjected to electrostatic discharge (ESD). The tiny form
factor means it can be used in very confined spaces. The electrical
‘back−to−back Zener’ configuration provides symmetrical ESD
protection in cases where nodes with AC signals are present. This
device is designed and characterized to safely dissipate ESD strikes of
at least
±3
kV, according to the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD.
Features
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ELECTRICAL SCHEMATIC
Au (Gold) on Topside
(Signal Node)
Au (Gold) on Topside
(Reference Node)
•
Compact Die Protects from ESD Discharges
•
Almost no Conduction at Signal Amplitudes less than +85 V
•
ESD Protection to over
±6
kV Contact Discharge per
MIL_STD_883 International ESD Standard
•
ESD Protection to over
±3
kV Contact Discharge per
IEC61000−4−2 Standard
•
These Devices are Pb−Free and are RoHS Compliant
Applications
•
LED Lighting
•
Modules
•
Interface Circuits
Silicon Substrate on Backside
Table 1. ORDERING INFORMATION
†
Part Numbering Information
Ordering Part Number
CM1771−5006YL
Topside Metal
Gold (Au)
Back Metal
None (silicon Substrate)
BG Thickness
6 mils
Inking?
N
Shipping Method
Wafer Jar
NOTE: Contact your sales representative for other ordering options.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
©
Semiconductor Components Industries, LLC, 2011
October, 2011
−
Rev. P6
1
Publication Order Number:
CM1771/D
CM1771
SPECIFICATIONS
Table 2. OPERATING CONDITIONS
Parameter
Operating Temperature Range
Storage Temperature Range
Rating
−40
to +150
−55
to +150
Units
°C
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS
Symbol
I
LEAK
V
BD
Leakage Current
Breakdown Voltage on Signal Node
Positive polarity on Signal Node
Negative polarity on Signal Node
ESD Voltage Rating
Contact Discharge per Human Body Model,
MIL−STD−883 (Method 3015)
Contact Discharge per IEC61000−4−2 Standard
Parameter
Conditions
V = +85 V, T
A
= 25°C
T
A
= 25°C
at 1.0 mA (I
CL+
)
at
−1.0
mA (I
CL−
)
(Notes 1 and 2)
+90
−80
±6
±3
+100
Min
Typ
Max
1.0
+110
−60
Units
mA
V
V
ESD
kV
1. Per the standard, 3 positive and 3 negative strikes are applied, one second apart.
2. V
ESD
is the ESD capability for the protection device only.
MECHANICAL DETAILS
Table 4. MECHANICAL SPECIFICATIONS
(Note 1)
Parameter
Composition
Die Shape
Length (Sawn)
Width (Sawn)
BG Thickness
Top Pad Length (a)
Top Pad Width (b)
Top Pads Spacing
Top Pad Composition
Top Pad Thickness
Back Metal (Underside)
Condition
Silicon Wafer,
P+ doped
Rectangular
480±10
440±10
6
356
117
103
Au (Gold)
3
None (silicon
Substrate)
mm
mm
mm
mils
mm
mm
mm
Unit
SAWN DIE DIAGRAM
1. Dimensions are typical values if tolerances are not specified.
Package Dimensions
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2
CM1771
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
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3
CM1771/D
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