Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BCR 196 E6327
MA000600030
PG-SOT23-3-11
Material Group
noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
arsenic
silicon
chromium
silicon
titanium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-38-2
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.005
0.000
0.043
0.008
0.001
0.003
2.704
0.013
0.058
0.087
0.116
1.243
4.277
0.150
0.098
Average
Mass
[%]
0.06
0.00
0.49
0.09
0.01
0.03
30.72
0.15
0.66
0.98
1.31
14.11
48.58
1.70
1.11
29. August 2013
8.80 mg
Sum
[%]
Average
Mass
[ppm]
569
3
0.55
4864
925
62
309
30.85
0.15
307186
1464
6565
9847
13130
141143
65.64
1.70
1.11
485794
16998
11141
656479
16998
11141
1000000
308482
1464
5436
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
NXP MCU
京公网安备 11010802033920号
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