NCN7201
2:1 Gigabit Ethernet LAN
Switch with Power-down
Feature
The NCN7201 is an 8−channel, bidirectional Ethernet switch
featuring a power shutdown feature with minimal current
consumption. The NCN7201 is an upgraded version of the NCN7200,
offering improved performance on the data lines while still
maintaining backwards compatibility. This switch is compatible with
10/100/1000 Base−T Ethernet standards, providing high bandwidth
and low return loss. Three additional lines are provided for status
indicator LEDs that switch. ESD protection is built into the switch.
This device can be used to route signals between a single Ethernet
transceiver and an RJ45 connector and a docking station. The
NCN7201 comes in a 42−pin WQFN package (3.5 mm x 9 mm, 0.5
mm pitch).
Features
http://onsemi.com
MARKING
DIAGRAM
NCN7201
AWLYYWWG
1
WQFN42
CASE 510AP
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
•
•
•
•
•
•
2:1 Multiplexer/ Demultiplexer LAN Switch
Three Additional Channels for LED Switching
Fully Specified for Power Supply Range: 3 V to 3.6 V
Power−down Feature Conserves Energy
Insertion loss of
−2.7
dB at 1 GHz
ESD Performance:
±8
kV Human Body Model (JEDEC)
±8
kV Contact Discharge (IEC61000−4−2)
•
This is a Pb−Free Device
Typical Applications
ORDERING INFORMATION
Device
Package
Shipping
†
NCN7201MTTWG WQFN42 2000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
•
Signal Routing for 10/100/1000 Mbps Ethernet
©
Semiconductor Components Industries, LLC, 2013
May, 2013
−
Rev. 2
1
Publication Order Number:
NCN7201/D
NCN7201
Figure 1. Block Diagram
TRUTH TABLE
PD
0
0
1
SEL
0
1
X
Function
AX to BX; LEDAX to LEDBX
AX to CX; LEDAX to LEDCX
Hi−Z
http://onsemi.com
2
NCN7201
PIN FUNCTION DESCRIPTION
Pin No.
1, 4, 8, 14, 30, 39
5
Pin Name
VDD
PD
Description
Power Supply Pin. It is recommended that a bypass capacitor of at least 0.1mF is
placed as close as possible to each VDD pin.
Power Down Pin. When PD is logic high, the device enters Power Down mode.
All switch paths are high impedance. There is no internal pull−up or pull−down
resistor; therefore, this pin cannot be floated.
Channel Select Pin. When PD is logic low, the SEL pin controls whether the AX
pins are connected to BX or CX. There is no internal pull−up or pull−down resist-
or; therefore, this pin cannot be floated.
Data Port A. This is the common side of the data switch.
Data Port B. This is a switchable port of the data switch.
Data Port C. This is a switchable port of the data switch.
LED Port A. This is the common side of the LED switch.
LED Port B. This is a switchable port of the LED switch.
LED Port C. This is a switchable port of the LED switch.
Ground Supply. The exposed pad provides ground reference to the device.
13
SEL
2, 3, 6, 7, 9, 10, 11, 12
24, 25, 28, 29, 33, 34, 37, 38
22, 23, 26, 27, 31, 32, 35, 36
15, 16, 42
17, 18, 41
19, 20, 40
Exposed Pad on Underside
AX+, AX*
BX+, BX*
CX+, CX*
LEDAX
LEDBX
LEDCX
GND
http://onsemi.com
3
NCN7201
Figure 2. Pin Description
(Top View)
http://onsemi.com
4
NCN7201
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Rating
Maximum Supply Voltage Range
Maximum Analog Signal Voltage Range
Maximum Voltage Range on Control Pins
Continuous Switch Current
Maximum Junction Temperature
Storage Temperature Range
Power Dissipation
ESD Capability (Note 2)
Human Body Model
Machine Model
Charged Device Model
Symbol
V
DD
V
IS
V
IN
I
IS
T
J(max)
T
STG
P
d
ESD
HBM
ESD
MM
ESD
CDM
I
LU
MSL
Value
−0.5
to 4.0
−0.5
to V
DD
+0.5
−0.5
to 6.0
120
150
−65
to 150
0.5
8000
400
2000
150
Level 1
Unit
V
V
V
mA
°C
°C
W
V
Latch−up Current (Note 2)
Moisture Sensitivity Level (Note 3)
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JEDEC standard: JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (JEDEC standard: JESD22−A115)
ESD Charged Device Model tested per AEC−Q1000−005 (JEDEC standard: JESD22−C101E)
Latch−up Current tested per JEDEC standard: JESD78
3. Moisture Sensitivity Level tested per IPC/JEDEC standard: J*STD*020A
OPERATING RANGES
Rating
Supply Voltage
Analog Signal Voltage
Control Input Voltage on PD and SEL
Ambient Temperature
Symbol
V
DD
V
IS
V
IN
T
A
Min
3.0
0
0
−40
Max
3.6
V
DD
V
DD
85
Unit
V
V
V
°C
http://onsemi.com
5