Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BGA 735N16 E6327
MA000943184
PG-TSNP-16-1
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
Substances
silicon
zinc
tin
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-66-6
7440-31-5
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.240
0.007
0.008
0.010
3.327
0.114
0.014
0.405
2.374
0.212
0.162
0.023
0.091
Average
Mass
[%]
3.43
0.10
0.12
0.14
47.61
1.63
0.20
5.80
33.98
3.04
2.32
0.33
1.30
29. August 2013
6.99 mg
Sum
[%]
3.43
Average
Mass
[ppm]
34305
960
1200
1440
47.97
1.63
476245
16264
1999
57968
39.98
3.04
2.32
339810
30361
23192
3251
1.63
13005
16256
1000000
399777
30361
23192
479845
16264
Sum
[ppm]
34305
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com