NCP6324, NCV6324
3 MHz, 2 A Synchronous
Buck Converter
High Efficiency, Low Ripple, Adjustable
Output Voltage
The NCP/NCV6324, a family of synchronous buck converters,
which is optimized to supply different sub systems of portable
applications powered by one cell Li−ion or three cell Alkaline/NiCd/
NiMH batteries. The devices are able to deliver up to 2 A on an
external adjustable voltage. Operation with 3 MHz switching
frequency allows employing small size inductor and capacitors. Input
supply voltage feedforward control is employed to deal with wide
input voltage range. Synchronous rectification and automatic
PWM/PFM power save mode offer improved system efficiency. The
NCP/NCV6324 is in a space saving, low profile 2.0 x 2.0 x 0.75 mm
WDFN−8 package or a WDFNW8 wettable flank package.
Features
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1
MARKING
DIAGRAM
1
WDFN8
CASE 511BE
XX MG
G
1
WDFNW8
CASE 511CL
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2.5 V to 5.5 V Input Voltage Range
External Adjustable Voltage
Up to 2 A Output Current
3 MHz Switching Frequency
Synchronous Rectification
Automatic Power Save (NCx6324B) or External Mode Selection
(NCx6324C)
Enable Input
Power Good Output Option (NCx6324B)
Soft Start
Over Current Protection
Active Discharge When Disabled
Thermal Shutdown Protection
WDFN−8, 2 x 2 mm, 0.5 mm Pitch Package and
WDFNW8, 2 x 2 mm, 0.5 mm Pitch Package with Wettable Flanks
Maximum 0.8mm Height for Super Thin Applications
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Cellular Phones, Smart Phones, and PDAs
Portable Media Players
Digital Still Cameras
Wireless and DSL Modems
PINOUT
PGND
SW
AGND
FB
1
2
9
3
4
(Top View)
6
5
MODE/PG
EN
8
7
PVIN
AVIN
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 2 of this data sheet.
Typical Applications
•
•
•
•
•
USB Powered Devices
•
Point of Load
•
Game and Entertainment System
©
Semiconductor Components Industries, LLC, 2015
May, 2017
−
Rev. 5
1
Publication Order Number:
NCP6324/D
NCP6324, NCV6324
Vo = 0.6V to Vin
Cout
10uF
R1
Cfb
1uH
NCx6324B
PGND
SW
AGND
FB
R2
PVIN
AVIN
PG
EN
Cin
10uF
Vin = 2.5V to 5.5V
Rpg
1M
Power Good
Enable
Vo = 0.6V to Vin
Cout
10uF
R1
Cfb
1uH
NCx6324C
PGND
SW
PVIN
AVIN
Cin
10uF
Mode
Enable
Vin = 2.5V to 5.5V
AGND MODE
FB
EN
R2
(a) Power Good Output Option
(NCx6324B)
(b) External Mode Selection
(NCx6324C)
Figure 1. Typical Application Circuits
PIN DESCRIPTION
Pin
1
2
3
4
5
6
Name
PGND
SW
AGND
FB
EN
PG/MODE
Type
Power
Ground
Power
Output
Analog
Ground
Analog
Input
Digital
Input
Digital
Output
Description
Power Ground for power, analog blocks. Must be connected to the system ground.
Switch Power pin connects power transistors to one end of the inductor.
Analog Ground analog and digital blocks. Must be connected to the system ground.
Feedback Voltage from the buck converter output. This is the input to the error amplifier. This pin
is connected to the resistor divider network between the output and AGND.
Enable of the IC. High level at this pin enables the device. Low level at this pin disables the de-
vice.
PG pin is for NCx6324B with Power Good option. It is open drain output. Low level at this pin indi-
cates the device is not in power good, while high impedance at this pin indicates the device is in
power good.
MODE pin is for NCx6324C with mode external selection option. High level at this pin forces the
device to operate in forced PWM mode. Low level at this pin enables the device to operate in
automatic PFM/PWM mode for power saving function.
Analog Supply. This pin is the analog and the digital supply of the device. An optional 1
mF
or lar-
ger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as close
as possible to this input.
Power Supply Input. This pin is the power supply of the device. A 10
mF
or larger ceramic capacit-
or must bypass this input to the ground. This capacitor should be placed as close a possible to
this input.
Exposed Pad. Must be soldered to system ground to achieve power dissipation performances.
This pin is internally unconnected
7
AVIN
Analog
Input
Power
Input
Exposed
Pad
8
PVIN
9
PAD
ORDERING INFORMATION
Device
NCP6324BMTAATBG
NCV6324BMTAATBG*
NCP6324CMTAATBG
NCV6324CMTAATBG*
NCV6324BMTAAWTBG*
NCV6324CMTAAWTBG*
Marking
4A
CE
C4
HA
WC
LF
WDFNW8 with Wettable Flanks
(Pb−Free)
WDFN8
(Pb−Free)
3000 / Tape & Reel
Package
Shipping
†
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
NCP6324, NCV6324
Vin
Cin
10uF
PVIN
8
SW
2
L
1uH
Cout
10uF
Vo
AVIN
7
UVLO
PWM / PFM
Control
PGND
1
R1
Cfb
FB
4
R2
Enable
Rpg
1M
EN
5
Power Good
MODE/PG
6
MODE
PG
Logic Control
&
Current Limit
&
Thermal
Shutdown
Error
Amp
AGND
3
Reference
Voltage
Figure 2. Functional Block Diagram
MAXIMUM RATINGS
Value
Rating
Input Supply Voltage to GND
Switch Node to GND
EN, PG/MODE to GND
FB to GND
Human Body Model (HBM) ESD Rating are (Note 1)
Machine Model (MM) ESD Rating (Note 1)
Latchup Current (Note 2)
Operating Junction Temperature Range (Note 3)
Operating Ambient Temperature Range
Storage Temperature Range
Thermal Resistance Junction−to−Top Case (Note 4)
Thermal Resistance Junction−to−Board (Note 4)
Thermal Resistance Junction−to−Ambient (Note 4)
Power Dissipation (Note 5)
Moisture Sensitivity Level (Note 6)
NCP6324
NCV6324
Symbol
V
PVIN
, V
AVIN
V
SW
V
EN
, V
PG
V
FB
ESD HBM
ESD MM
I
LU
T
J
T
A
T
STG
R
qJC
R
qJB
R
qJA
P
D
MSL
−100
−40
−40
−40
−55
12
30
62
1.6
1
Min
−0.3
−0.3
−0.3
−0.3
Max
7.0
7.0
7.0
7.0
2000
200
100
125
85
125
150
Unit
V
V
V
V
V
V
mA
°C
°C
°C
°C/W
°C/W
°C/W
W
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM)
±2.0
kV per JEDEC standard: JESD22−A114.
Machine Model (MM)
±200
V per JEDEC standard: JESD22−A115.
2. Latchup Current per JEDEC standard: JESD78 Class II.
3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation.
4. The thermal resistance values are dependent of the PCB heat dissipation. The board used to drive this data was an 80x50 mm NCP6324EVB
board. It is a multilayer board with 1 ounce internal power and ground planes and 2−1 ounce copper traces on top and bottom of the board.
If the copper traces of top and bottom are 1 ounce too, R
qJC
= 11°C/W, R
qJB
= 30°C/W, and R
qJA
= 72°C/W.
5. The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected.
6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
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NCP6324, NCV6324
ELECTRICAL CHARACTERISTICS
(V
IN
= 3.6 V, V
OUT
= 1.8 V, L = 1
mH,
C = 10
mF,
typical values are referenced to T
J
= 25°C, Min
and Max values are referenced to T
J
up to 125°C, unless other noted.)
Symbol
SUPPLY VOLTAGE
V
IN
I
Q
I
SD
V
OUT
V
FB
Input Voltage V
IN
Range
V
IN
Quiescent Supply Current
V
IN
Shutdown Current
Output Voltage Range
FB Voltage
FB Voltage in Load Regulation
FB Voltage in Line Regulation
D
MAX
I
OUTMAX
I
LIMP
I
LIMN
V
INUV−
V
INHYS
V
PGL
V
PGHYS
Maximum Duty Cycle
Output Current Capability
Output Peak Current Limit P−Channel
Output Peak Current Limit N−Channel
V
IN
UVLO Falling Threshold
V
IN
UVLO Hysteresis
Power Good Low Threshold
Power Good Hysteresis
V
OUT
falls down to cross the threshold
(percentage of FB voltage) (Note 8)
V
OUT
rises up to cross the threshold
(percentage of Power Good Low Threshold
(V
PGL
) voltage) (Note 8)
From EN rising edge to PG going high.
(Note 8)
From EN falling edge to PG going low.
(Notes 7 and 8)
From V
FB
going higher than 95% nominal
level to PG going high.
Not for the first time in start up. (Notes 7
and 8)
From V
FB
going lower than 90% nominal
level to PG going low. (Notes 7 and 8)
Voltage at PG pin with 5 mA sink current
(Note 8)
3.6 V at PG pin when power good valid
(Note 8)
−
60
87
0
(Note 10)
EN high, no load, no switching, PFM Mode
EN high, no load, Forced PWM Mode
EN low (Note 9 for NCP6324)
(Note 7)
PWM Mode
V
IN
= 3.6 V, I
OUT
from 200 mA to I
OUTMAX
,
PWM mode (Note 7)
I
OUT
= 200 mA, V
IN
from MAX (V
NOM
+
0.5 V, 2.5 V) to 5.5 V, PWM mode (Note 7)
(Note 7)
(Note 7)
2.5
−
−
−
0.6
594
−
−
−
2.0
2.3
−
30
5.7
−
−
600
−0.5
0
100
−
2.8
0.9
−
140
90
5
2.4
200
92
7
5.5
−
−
1
V
IN
606
−
−
−
−
3.3
V
SUPPLY CURRENT
mA
mA
mA
V
mV
%/A
%/V
%
A
A
A
V
mV
%
%
Characteristics
Test Conditions
Min
Typ
Max
Unit
OUTPUT VOLTAGE
OUTPUT CURRENT
VOLTAGE MONITOR
Td
PGH1
Td
PGL1
Td
PGH
Power Good High Delay in Start Up
Power Good Low Delay in Shut Down
Power Good High Delay in Regulation
−
−
−
1.15
8
5
−
−
−
ms
ms
ms
Td
PGL
VPG_L
PG_LK
Power Good Low Delay in Regulation
Power Good Pin Low Voltage
Power Good Pin Leakage Current
−
−
−
8
−
−
−
0.3
100
ms
V
nA
INTEGRATED MOSFETs
R
ON_H
R
ON_L
High−Side MOSFET ON Resistance
Low−Side MOSFET ON Resistance
V
IN
= 3.6 V (Note 9 for NCP6324)
V
IN
= 5 V (Note 9 for NCP6324)
V
IN
= 3.6 V (Note 9 for NCP6324)
V
IN
= 5 V (Note 9 for NCP6324)
−
−
−
−
160
130
110
100
200
−
140
−
mW
mW
7. Guaranteed by design, not tested in production.
8. Power Good function is for NCx6324B devices only.
9. Maximum value applies for T
J
= 85°C.
10. Operation above 5.5 V input voltage for extended periods may affect device reliability. At the first power−up, input voltage must be > 2.6 V.
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NCP6324, NCV6324
ELECTRICAL CHARACTERISTICS
(V
IN
= 3.6 V, V
OUT
= 1.8 V, L = 1
mH,
C = 10
mF,
typical values are referenced to T
J
= 25°C, Min
and Max values are referenced to T
J
up to 125°C, unless other noted.)
Symbol
Characteristics
Test Conditions
Min
Typ
Max
Unit
SWITCHING FREQUENCY
F
SW
T
SS
Normal Operation Frequency
Soft−Start Time
Time from EN to 90% of output voltage
target
2.7
−
3.0
0.4
3.3
1
MHz
ms
SOFT START
CONTROL LOGIC
V
EN_H
V
EN_L
V
EN_HYS
I
EN_BIAS
V
MODE_H
V
MODE_L
EN Input High Voltage
EN Input Low Voltage
EN Input Hysteresis
EN Input Bias Current
MODE Input High Voltage
MODE Input Low Voltage
(Note 11)
(Note 11)
(Note 11)
(Note 11)
from SW to PGND
75
−
−
1.1
−
−
1.1
−
−
−
−
270
0.1
−
−
270
0.1
500
150
25
−
0.4
−
1
−
0.4
−
1
700
−
−
V
V
mV
mA
V
V
mV
mA
W
°C
°C
V
MODE_HYS
MODE Input Hysteresis
I
MODE_BIAS
MODE Input Bias Current
OUTPUT ACTIVE DISCHARGE
R_DIS
T
SD
T
SD_HYS
Internal Output Discharge Resistance
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
THERMAL SHUTDOWN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Mode function is for NCx6324C devices only.
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