Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP47N10S-33
MA000532840
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
7.916
0.816
0.245
815.335
3.209
8.893
97.821
486.141
21.462
0.244
0.001
0.137
0.109
5.219
0.177
0.590
589.466
Average
Mass
[%]
0.39
0.04
0.01
39.99
0.16
0.44
4.80
23.86
1.05
0.01
0.00
0.01
0.01
0.26
0.01
0.03
28.93
29. August 2013
2037.78 mg
Sum
[%]
0.39
Average
Mass
[ppm]
3885
401
120
40.04
0.16
400109
1575
4364
48004
29.10
1.05
238563
10532
120
0.01
0
67
54
0.28
2561
87
290
28.97
289268
289645
1000000
2682
120
290931
10532
400630
1575
Sum
[ppm]
3885
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com