Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP80P03P4L-07
MA000461994
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
lead
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7439-92-1
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
2.218
0.816
0.245
815.335
5.801
8.938
98.316
488.602
21.462
0.244
0.001
2.011
0.053
0.042
0.177
0.590
589.466
Average
Mass
[%]
0.11
0.04
0.01
40.07
0.29
0.44
4.83
24.02
1.06
0.01
0.00
0.10
0.00
0.00
0.01
0.03
28.98
29. August 2013
2034.32 mg
Sum
[%]
0.11
Average
Mass
[ppm]
1090
401
120
40.12
0.29
400790
2851
4394
48329
29.29
1.06
240180
10550
120
0.01
1
989
26
0.10
21
87
290
29.02
289761
290138
1000000
1036
120
292903
10550
401312
2851
Sum
[ppm]
1090
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
分立器件
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