Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPG20N04S4-12A
MA000965574
PG-TDSON-8-10
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.736
0.046
0.014
46.380
0.725
0.091
6.433
38.780
1.396
0.001
0.603
0.056
0.045
2.142
Average
Mass
[%]
1.76
0.05
0.01
47.11
0.74
0.09
6.53
39.39
1.42
0.00
0.61
0.06
0.05
2.18
29. August 2013
98.45 mg
Sum
[%]
1.76
Average
Mass
[ppm]
17638
472
142
47.17
0.74
471109
7362
920
65344
46.01
1.42
393906
14184
15
0.61
6126
570
456
2.29
21756
22782
1000000
6141
460170
14184
471723
7362
Sum
[ppm]
17638
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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