Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BSS308PE H6327
MA000949834
PG-SOT23-3-5
Material Group
non noble metal
noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
tin
gold
silicon
chromium
silicon
titanium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.004
0.017
0.261
0.009
0.001
0.003
3.000
0.076
0.056
1.207
4.352
0.150
0.284
Average
Mass
[%]
0.05
0.18
2.77
0.10
0.01
0.03
31.85
0.81
0.60
12.82
46.17
1.59
3.02
19. December 2014
9.42 mg
Sum
[%]
Average
Mass
[ppm]
468
1816
3.00
27699
959
64
320
31.99
0.81
318467
8063
5961
128155
59.59
1.59
3.02
461956
15883
30189
596072
15883
30189
1000000
319810
8063
29983
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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