Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPW50R350CP
MA000909230
PG-TO247-3-21
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
5.444
3.972
1.192
3967.074
2.489
21.454
44.859
50.710
370.572
1462.786
31.874
29.065
0.298
0.744
1.935
Average
Mass
[%]
0.09
0.07
0.02
66.19
0.04
0.36
0.75
0.85
6.18
24.40
0.53
0.48
0.00
0.01
0.03
29. August 2013
5994.47 mg
Sum
[%]
0.09
Average
Mass
[ppm]
908
663
199
66.28
0.04
661789
415
3579
7483
8459
61819
32.54
0.53
0.48
244023
5317
4849
50
124
0.04
323
497
1000000
325363
5317
4849
662651
415
Sum
[ppm]
908
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com