Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB50R250CP
MA000904468
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
7.183
0.304
0.091
304.026
2.594
10.248
112.733
560.246
9.657
0.228
0.001
0.128
0.103
4.908
0.165
0.548
547.666
Average
Mass
[%]
0.46
0.02
0.01
19.48
0.17
0.66
7.22
35.88
0.62
0.01
0.00
0.01
0.01
0.31
0.01
0.04
35.09
29. August 2013
1560.83 mg
Sum
[%]
0.46
Average
Mass
[ppm]
4602
195
59
19.51
0.17
194785
1662
6566
72226
43.76
0.62
358941
6187
146
0.01
1
82
66
0.33
3145
105
351
35.14
350881
351337
1000000
3293
146
437734
6187
195039
1662
Sum
[ppm]
4602
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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