Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP034N03L G
MA000867482
PG-TO220-3-123
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
2.247
1.407
0.422
1404.801
5.953
2.344
67.988
515.773
21.462
1.764
0.150
0.376
0.977
Average
Mass
[%]
0.11
0.07
0.02
69.34
0.29
0.12
3.36
25.46
1.06
0.09
0.01
0.02
0.05
29. August 2013
2025.66 mg
Sum
[%]
0.11
Average
Mass
[ppm]
1109
694
208
69.43
0.29
693503
2939
1157
33563
28.94
1.06
0.09
254619
10595
871
74
186
0.08
482
742
1000000
289339
10595
871
694405
2939
Sum
[ppm]
1109
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com