Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPW60R099CP
MA000849054
PG-TO247-3-41
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
phosphorus
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7723-14-0
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
15.501
1.192
3.972
3967.074
4.245
19.922
378.510
1593.725
31.874
29.065
0.514
1.284
3.339
Average
Mass
[%]
0.26
0.02
0.07
65.55
0.07
0.33
6.26
26.34
0.53
0.48
0.01
0.02
0.06
29. August 2013
6050.18 mg
Sum
[%]
0.26
Average
Mass
[ppm]
2562
197
656
65.64
0.07
655692
702
3293
62561
32.93
0.53
0.48
263416
5268
4804
85
212
0.09
552
849
1000000
329270
5268
4804
656545
702
Sum
[ppm]
2562
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
stm32/stm8
京公网安备 11010802033920号
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