Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPG20N06S4L-26
MA000840896
PG-TDSON-8-4
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
1.567
0.045
0.013
44.654
0.761
0.091
6.475
39.031
1.308
0.048
0.000
0.048
0.060
2.278
Average
Mass
[%]
1.63
0.05
0.01
46.33
0.79
0.09
6.72
40.50
1.36
0.05
0.00
0.05
0.06
2.36
29. August 2013
96.38 mg
Sum
[%]
1.63
Average
Mass
[ppm]
16256
464
139
46.39
0.79
463324
7891
946
67181
47.31
1.36
404979
13568
498
0.05
1
495
619
2.47
23639
24753
1000000
499
473106
13568
463927
7891
Sum
[ppm]
16256
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com