Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
DSL70 E6327
MA000787194
PG-SOT143-4-10
Material Group
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
arsenic
gold
silicon
silicon
titanium
chromium
copper
gold
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-38-2
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.018
0.102
0.001
0.005
0.015
4.981
0.108
0.102
0.152
0.190
1.587
4.317
0.217
0.122
Average
Mass
[%]
0.00
0.15
0.86
0.01
0.04
0.13
41.79
0.91
0.85
1.28
1.60
13.32
36.22
1.82
1.02
29. August 2013
11.92 mg
Sum
[%]
Average
Mass
[ppm]
15
1508
1.01
8583
84
420
1259
41.97
0.91
417929
9077
8523
12785
15981
133176
53.27
1.82
1.02
362237
18174
10249
532702
18174
10249
1000000
419692
9077
10106
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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