Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPS075N03L G
MA000707218
PG-TO251-3-311
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
0.899
0.176
0.053
175.989
2.179
0.328
19.793
128.925
3.002
0.004
1.555
0.029
0.023
1.103
Average
Mass
[%]
0.27
0.05
0.02
52.67
0.65
0.10
5.93
38.59
0.90
0.00
0.47
0.01
0.01
0.33
29. August 2013
334.06 mg
Sum
[%]
0.27
Average
Mass
[ppm]
2691
528
158
52.74
0.65
526824
6522
982
59252
44.62
0.90
385938
8985
11
0.47
4653
86
69
0.35
3301
3456
1000000
4664
446172
8985
527510
6522
Sum
[ppm]
2691
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com