Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPA20N60C3
MA001004040
PG-TO220-3-253
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
12.312
1.431
0.429
1428.770
3.009
3.310
129.105
529.661
21.731
1.786
0.537
1.342
3.489
Average
Mass
[%]
0.58
0.07
0.02
66.86
0.14
0.15
6.04
24.79
1.02
0.08
0.03
0.06
0.16
20. April 2015
2136.91 mg
Sum
[%]
0.58
Average
Mass
[ppm]
5762
669
201
66.95
0.14
668614
1408
1549
60417
30.98
1.02
0.08
247863
10169
836
251
628
0.25
1633
2512
1000000
309829
10169
836
669484
1408
Sum
[ppm]
5762
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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