Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE8718SA
MA001011680
PG-DSO-36-54
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
16.828
0.388
1.553
31.066
1261.410
8.302
1.524
70.087
690.200
15.044
0.644
0.188
0.125
12.208
Average
Mass
[%]
0.80
0.02
0.07
1.47
59.80
0.39
0.07
3.32
32.72
0.71
0.03
0.01
0.01
0.58
31. October 2014
2109.57 mg
Sum
[%]
0.80
Average
Mass
[ppm]
7977
184
736
14726
61.36
0.39
597949
3935
722
33223
36.11
0.71
0.03
327177
7131
305
89
59
0.60
5787
5935
1000000
361122
7131
305
613595
3935
Sum
[ppm]
7977
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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