Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC150N03LD G
MA000359618
PG-TDSON-8-4
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.123
0.045
0.013
44.654
0.552
0.092
6.566
39.580
1.308
0.048
0.000
0.044
0.035
1.669
Average
Mass
[%]
1.17
0.05
0.01
46.63
0.58
0.10
6.86
41.35
1.37
0.05
0.00
0.05
0.04
1.74
31. October 2014
95.73 mg
Sum
[%]
1.17
Average
Mass
[ppm]
11735
467
140
46.69
0.58
466457
5768
966
68588
48.31
1.37
413458
13660
501
0.05
1
456
365
1.83
17438
18259
1000000
502
483012
13660
467064
5768
Sum
[ppm]
11735
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com