Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX9201SG
MA001281548
PG-DSO-12-17
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.352
0.060
0.240
4.792
194.567
1.484
0.310
14.261
140.443
3.243
2.024
0.152
0.121
5.798
Average
Mass
[%]
1.44
0.02
0.06
1.29
52.18
0.40
0.08
3.82
37.67
0.87
0.54
0.04
0.03
1.56
20. August 2015
372.85 mg
Sum
[%]
1.44
Average
Mass
[ppm]
14354
161
643
12852
53.55
0.40
521842
3979
832
38250
41.57
0.87
0.54
376676
8698
5429
407
326
1.63
15551
16284
1000000
415758
8698
5429
535498
3979
Sum
[ppm]
14354
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
51单片机
京公网安备 11010802033920号
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