Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
XMC1301-T016X0016 AB
MA001342894
PG-TSSOP-16-8
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
palladium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-05-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.226
0.007
0.027
0.537
21.811
0.001
0.130
0.108
4.231
31.825
0.915
0.558
0.111
0.332
Average
Mass
[%]
1.98
0.01
0.04
0.87
35.28
0.00
0.21
0.18
6.84
51.49
1.48
0.90
0.18
0.54
27. March 2015
61.82 mg
Sum
[%]
1.98
Average
Mass
[ppm]
19827
109
434
8689
36.20
352813
21
0.21
2104
1755
68447
58.51
1.48
0.90
514813
14798
9021
1792
0.72
5377
7169
1000000
585015
14798
9021
2125
362045
Sum
[ppm]
19827
wire
encapsulation
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
模拟电子
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