Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE7181EM
MA000978512
PG-SSOP-24-4
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.244
0.017
0.067
1.345
54.617
0.537
0.171
7.886
77.663
2.911
0.234
0.295
0.886
Average
Mass
[%]
2.81
0.01
0.04
0.89
36.20
0.36
0.11
5.23
51.47
1.93
0.16
0.20
0.59
28. August 2013
150.88 mg
Sum
[%]
2.81
Average
Mass
[ppm]
28131
111
446
8915
37.14
0.36
362002
3556
1136
52271
56.81
1.93
0.16
514753
19294
1553
1958
0.79
5874
7832
1000000
568160
19294
1553
371474
3556
Sum
[ppm]
28131
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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