Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE7269G
MA000977678
PG-DSO-14-24
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
gold
silver
palladium
nickel
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-05-3
7440-02-0
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.889
0.016
0.062
1.250
50.740
0.371
0.182
9.832
81.023
0.003
0.002
0.002
0.056
0.307
1.090
Average
Mass
[%]
2.61
0.01
0.04
0.84
34.09
0.25
0.12
6.61
54.45
0.00
0.00
0.00
0.04
0.21
0.73
28. August 2013
148.82 mg
Sum
[%]
2.61
Average
Mass
[ppm]
26129
105
420
8397
34.98
0.25
340941
2490
1223
66064
61.18
544419
21
11
13
0.04
376
2066
0.94
7325
9391
1000000
421
611706
349863
2490
Sum
[ppm]
26129
wire
encapsulation
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
non noble metal
plastics
noble metal
< 10%
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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