Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE7279-2G V50
MA000970642
PG-DSO-14-30
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.362
0.015
0.060
1.207
49.007
0.302
0.173
7.969
78.479
1.226
1.030
0.277
0.982
Average
Mass
[%]
1.65
0.01
0.04
0.84
34.25
0.21
0.12
5.57
54.85
0.86
0.72
0.19
0.69
28. August 2013
143.09 mg
Sum
[%]
1.65
Average
Mass
[ppm]
16506
105
422
8435
35.14
0.21
342492
2112
1211
55693
60.54
0.86
0.72
548459
8569
7197
1936
0.88
6863
8799
1000000
605363
8569
7197
351454
2112
Sum
[ppm]
16506
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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