Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE7270-2D
MA000669534
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.671
0.205
0.061
204.243
0.181
1.417
24.792
115.460
5.072
0.076
0.000
0.083
0.067
3.180
Average
Mass
[%]
0.47
0.06
0.02
57.29
0.05
0.40
6.95
32.39
1.42
0.02
0.00
0.02
0.02
0.89
28. August 2013
356.51 mg
Sum
[%]
0.47
Average
Mass
[ppm]
4688
574
172
57.37
0.05
572897
507
3974
69541
39.74
1.42
323862
14228
214
0.02
1
234
187
0.93
8921
9342
1000000
215
397377
14228
573643
507
Sum
[ppm]
4688
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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