Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLV4946-2L
MA000608286
PG-SSO-3-2
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
Substances
silicon
chromium
titanium
silver
tin
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-47-3
7440-32-6
7440-22-4
7440-31-5
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.563
0.153
0.153
0.204
0.306
50.200
0.039
0.211
0.264
0.527
4.799
20.567
4.889
0.284
0.048
0.191
Average
Mass
[%]
0.67
0.18
0.18
0.24
0.37
60.21
0.05
0.25
0.32
0.63
5.75
24.66
5.86
0.34
0.06
0.23
28. August 2013
83.40 mg
Sum
[%]
0.67
Average
Mass
[ppm]
6747
1835
1835
2447
3670
61.18
0.05
601929
465
2529
3162
6323
57544
31.61
5.86
0.34
246616
58624
3410
573
0.29
2291
2864
1000000
316174
58624
3410
611716
465
Sum
[ppm]
6747
wire
encapsulation
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
leadfinish
plating
glue
*deviation
non noble metal
noble metal
plastics
noble metal
< 10%
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
