Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE5206-2GP
MA000543916
PG-DSO-20-37
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[g]
0.000
0.000
0.000
0.000
0.000
0.000
0.000
0.000
0.000
0.000
0.000
0.000
0.000
Average
Mass
[%]
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
Sum in total:
28. August 2013
1.15 g
Sum
[%]
Average
Mass
[ppm]
0
0
0
0
0
0
0
0
0
0
0
0
0
0,00
3600
21601
3600
3600
3600
3600
Sum
[ppm]
3600
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
solder
*deviation
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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