MUN5214DW1,
NSBC114YDXV6,
NSBC114YDP6
Dual NPN Bias Resistor
Transistors
R1 = 10 kW, R2 = 47 kW
NPN Transistors with Monolithic Bias
Resistor Network
This series of digital transistors is designed to replace a single
device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a
base-emitter resistor. The BRT eliminates these individual
components by integrating them into a single device. The use of a BRT
can reduce both system cost and board space.
Features
(3)
R
1
Q
1
Q
2
R
2
R
1
(5)
(6)
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PIN CONNECTIONS
(2)
(1)
R
2
•
•
•
•
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC-Q101 Qualified and PPAP Capable*
•
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
A
= 25°C, common for Q
1
and Q
2
, unless otherwise noted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current − Continuous
Input Forward Voltage
Input Reverse Voltage
Symbol
V
CBO
V
CEO
I
C
V
IN(fwd)
V
IN(rev)
Max
50
50
100
40
6
Unit
Vdc
Vdc
mAdc
Vdc
Vdc
(4)
MARKING DIAGRAMS
6
SOT−363
CASE 419B
1
7D M
G
G
SOT−563
CASE 463A
1
7D M
G
G
SOT−963
CASE 527AD
1
7D/P
M
G
PMG
G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
Device
MUN5214DW1T1G,
SMUN5214DW1T1G*
NSVMUN5214DW1T3G*
NSBC114YDXV6T1G
NSVBC114YDXV6T1G
NSBC114YDXV6T5G
NSBC114YDP6T5G
Package
SOT−363
SOT−363
SOT−563
SOT−563
SOT−963
Shipping
†
3,000 / Tape & Reel
10,000 / Tape & Reel
4,000 / Tape & Reel
8,000 / Tape & Reel
8,000 / Tape & Reel
= Specific Device Code
= Date Code*
= Pb-Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
†For information on tape and reel specifications, including part orientation and
tape sizes, please refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2014
1
September, 2014 − Rev. 2
Publication Order Number:
DTC114YD/D
MUN5214DW1, NSBC114YDXV6, NSBC114YDP6
THERMAL CHARACTERISTICS
Characteristic
MUN5214DW1 (SOT−363) ONE JUNCTION HEATED
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
MUN5214DW1 (SOT−363) BOTH JUNCTION HEATED
(Note 3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
NSBC114YDXV6 (SOT−563) ONE JUNCTION HEATED
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
NSBC114YDXV6 (SOT−563) BOTH JUNCTION HEATED
(Note 3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Junction and Storage Temperature Range
NSBC114YDP6 (SOT−963) ONE JUNCTION HEATED
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
NSBC114YDP6 (SOT−963) BOTH JUNCTION HEATED
(Note 3)
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Junction and Storage Temperature Range
1.
2.
3.
4.
5.
FR−4 @ Minimum Pad.
FR−4 @ 1.0
×
1.0 Inch Pad.
Both junction heated values assume total power is sum of two equally powered channels.
FR−4 @ 100 mm
2
, 1 oz. copper traces, still air.
FR−4 @ 500 mm
2
, 1 oz. copper traces, still air.
P
D
(Note 4)
(Note 5)
(Note 4)
(Note 5)
(Note 4)
(Note 5)
R
qJA
339
408
2.7
3.3
369
306
−55 to +150
°C
MW
mW/°C
°C/W
P
D
(Note 4)
(Note 5)
(Note 4)
(Note 5)
(Note 4)
(Note 5)
R
qJA
231
269
1.9
2.2
540
464
MW
mW/°C
°C/W
P
D
(Note 1)
(Note 1)
(Note 1)
R
qJA
T
J
, T
stg
500
4.0
250
−55 to +150
°C
mW
mW/°C
°C/W
P
D
(Note 1)
(Note 1)
(Note 1)
R
qJA
357
2.9
350
mW
mW/°C
°C/W
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
250
385
2.0
3.0
493
325
°C/W
188
208
−55 to +150
°C
mW
mW/°C
°C/W
P
D
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
R
qJA
187
256
1.5
2.0
670
490
mW
mW/°C
°C/W
Symbol
Max
Unit
R
qJL
T
J
, T
stg
T
J
, T
stg
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2
MUN5214DW1, NSBC114YDXV6, NSBC114YDP6
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C, common for Q
1
and Q
2
, unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector-Base Cutoff Current
(V
CB
= 50 V, I
E
= 0)
Collector-Emitter Cutoff Current
(V
CE
= 50 V, I
B
= 0)
Emitter-Base Cutoff Current
(V
EB
= 6.0 V, I
C
= 0)
Collector-Base Breakdown Voltage
(I
C
= 10
mA,
I
E
= 0)
Collector-Emitter Breakdown Voltage (Note 6)
(I
C
= 2.0 mA, I
B
= 0)
ON CHARACTERISTICS
DC Current Gain (Note 6)
(I
C
= 5.0 mA, V
CE
= 10 V)
Collector-Emitter Saturation Voltage (Note 6)
(I
C
= 10 mA, I
B
= 0.3 mA)
Input Voltage (Off)
(V
CE
= 5.0 V, I
C
= 100
mA)
Input Voltage (On)
(V
CE
= 0.2 V, I
C
= 1.0 mA)
Output Voltage (On)
(V
CC
= 5.0 V, V
B
= 2.5 V, R
L
= 1.0 kW)
Output Voltage (Off)
(V
CC
= 5.0 V, V
B
= 0.5 V, R
L
= 1.0 kW)
Input Resistor
Resistor Ratio
6. Pulsed Condition: Pulse Width = 300 ms, Duty Cycle
≤
2%.
h
FE
80
V
CE(sat)
−
V
i(off)
−
V
i(on)
1.4
V
OL
−
V
OH
4.9
R1
R
1
/R
2
7
0.17
−
10
0.21
−
13
0.25
kW
−
0.2
Vdc
0.8
−
Vdc
0.7
0.3
Vdc
−
0.25
Vdc
140
−
V
I
CBO
−
I
CEO
−
I
EBO
−
V
(BR)CBO
50
V
(BR)CEO
50
−
−
−
−
Vdc
−
0.2
Vdc
−
500
mAdc
−
100
nAdc
nAdc
Symbol
Min
Typ
Max
Unit
400
P
D
, POWER DISSIPATION (mW)
350
300
250
200
150
100
50
0
−50
−25
0
25
50
75
100
125
150
(1) (2) (3)
(1) SOT−363; 1.0
×
1.0 Inch Pad
(2) SOT−563; Minimum Pad
(3) SOT−963; 100 mm
2
, 1 oz. Copper Trace
AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
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3
MUN5214DW1, NSBC114YDXV6, NSBC114YDP6
TYPICAL CHARACTERISTICS
MUN5214DW1, NSBC114YDXV6
V
CE(sat)
, COLLECTOR−EMITTER VOLTAGE (V)
1
I
C
/I
B
= 10
h
FE
, DC CURRENT GAIN
1000
V
CE
= 10 V
25°C
100
−55°C
150°C
25°C
0.1
150°C
10
−55°C
0.01
0
10
20
30
40
50
I
C
, COLLECTOR CURRENT (mA)
1
0.1
1
10
I
C
, COLLECTOR CURRENT (mA)
100
Figure 2. V
CE(sat)
vs. I
C
Figure 3. DC Current Gain
3.6
C
ob
, OUTPUT CAPACITANCE (pF)
I
C
, COLLECTOR CURRENT (mA)
3.2
2.8
2.4
2
1.6
1.2
0.8
0.4
0
0
10
20
30
40
50
V
R
, REVERSE VOLTAGE (V)
f = 10 kHz
I
E
= 0 A
T
A
= 25°C
100
10
−55°C
1
25°C
150°C
0.1
0.01
V
O
= 5 V
0
1
2
3
4
5
6
7
V
in
, INPUT VOLTAGE (V)
8
9
10
0.001
Figure 4. Output Capacitance
Figure 5. Output Current vs. Input Voltage
100
V
in
, INPUT VOLTAGE (V)
10
25°C
−55°C
1
150°C
V
O
= 0.2 V
0.1
0
10
20
30
40
I
C
, COLLECTOR CURRENT (mA)
50
Figure 6. Input Voltage vs. Output Current
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4
MUN5214DW1, NSBC114YDXV6, NSBC114YDP6
TYPICAL CHARACTERISTICS
NSBC114YDP6
V
CE(sat)
, COLLECTOR−EMITTER VOLTAGE (V)
1
I
C
/I
B
= 10
h
FE
, DC CURRENT GAIN
1000
V
CE
= 10 V
25°C
100
150°C
25°C
−55°C
0.1
150°C
10
−55°C
0.01
0
10
20
30
40
50
I
C
, COLLECTOR CURRENT (mA)
1
0.1
1
10
I
C
, COLLECTOR CURRENT (mA)
100
Figure 7. V
CE(sat)
vs. I
C
Figure 8. DC Current Gain
2.4
C
ob
, OUTPUT CAPACITANCE (pF)
2
1.6
1.2
0.8
0.4
0
0
10
20
30
40
50
V
R
, REVERSE VOLTAGE (V)
I
C
, COLLECTOR CURRENT (mA)
f = 10 kHz
I
E
= 0 A
T
A
= 25°C
100
−55°C
10
1
25°C
0.1
0.01
150°C
V
O
= 5 V
0
1
2
3
4
5
V
in
, INPUT VOLTAGE (V)
6
7
0.001
Figure 9. Output Capacitance
Figure 10. Output Current vs. Input Voltage
100
V
in
, INPUT VOLTAGE (V)
10
25°C
−55°C
1
150°C
V
O
= 0.2 V
0.1
0
10
20
30
40
I
C
, COLLECTOR CURRENT (mA)
50
Figure 11. Input Voltage vs. Output Current
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