Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4470GS
MA000970038
PG-DSO-14-30
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.953
0.015
0.060
1.207
49.007
0.312
0.168
7.726
76.080
1.226
1.030
0.416
1.473
Average
Mass
[%]
3.45
0.01
0.04
0.84
34.11
0.22
0.12
5.38
52.94
0.85
0.72
0.29
1.03
28. August 2013
143.67 mg
Sum
[%]
3.45
Average
Mass
[ppm]
34473
105
420
8401
35.00
0.22
341100
2175
1169
53772
58.44
0.85
0.72
529537
8534
7168
2892
1.32
10254
13146
1000000
584478
8534
7168
350026
2175
Sum
[ppm]
34473
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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