Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4998P3
MA000873788
PG-SSO-3-10
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.851
0.020
0.099
0.297
98.494
0.049
0.357
4.511
27.585
5.779
0.604
0.264
1.056
Average
Mass
[%]
2.69
0.01
0.07
0.21
68.91
0.03
0.25
3.16
19.29
4.04
0.42
0.18
0.74
28. August 2013
142.97 mg
Sum
[%]
2.69
Average
Mass
[ppm]
26940
138
692
2076
69.20
0.03
688931
344
2497
31553
22.70
4.04
0.42
192947
40425
4222
1847
0.92
7388
9235
1000000
226997
40425
4222
691837
344
Sum
[ppm]
26940
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
stm32/stm8
京公网安备 11010802033920号
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