Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4274GS V33
MA000839002
PG-SOT223-4-21
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.163
0.010
0.051
0.152
50.489
0.222
0.461
0.577
1.153
10.495
44.980
1.464
0.513
0.071
0.333
Average
Mass
[%]
1.04
0.01
0.05
0.14
45.01
0.20
0.41
0.51
1.03
9.36
40.11
1.31
0.46
0.06
0.30
28. August 2013
112.13 mg
Sum
[%]
1.04
Average
Mass
[ppm]
10368
90
452
1356
45.21
0.20
450259
1979
4114
5143
10285
93597
51.42
1.31
0.46
401131
13056
4575
629
0.36
2966
3595
1000000
514270
13056
4575
452157
1979
Sum
[ppm]
10368
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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