Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4284D V26
MA000724042
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
2.924
0.140
0.042
139.706
0.131
0.311
14.284
140.661
3.740
0.091
0.000
0.114
0.091
4.363
0.028
0.095
94.488
Average
Mass
[%]
0.73
0.03
0.01
34.82
0.03
0.08
3.56
35.07
0.93
0.02
0.00
0.03
0.02
1.09
0.01
0.02
23.55
28. August 2013
401.21 mg
Sum
[%]
0.73
Average
Mass
[ppm]
7288
349
105
34.86
0.03
348211
326
774
35601
38.71
0.93
350593
9322
226
0.02
1
285
228
1.14
10875
71
236
23.58
235509
235816
1000000
11388
227
386968
9322
348665
326
Sum
[ppm]
7288
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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